陈志强
个人信息:Personal Information
讲师 研究生导师
性别:男
毕业院校:西安电子科技大学
学历:博士研究生毕业
学位:工学博士学位
在职信息:在岗
所在单位:机电工程学院
入职时间:2020-07-06
学科:机械电子工程
办公地点:北校区主楼三区413-3
电子邮箱:
扫描关注
1、先进电子封装可靠性
主要研究如下图所示BGA封装器件随机振动、温度循环以及电气可靠性问题,以及超声热压键合、回流焊等工艺对于芯片可靠性影响规律。
2、微机电系统器件
主要研究如下图所示MEMS器件设计加工,以及MEMS器件可靠性问题。
- The Reliability of the Complex Components under Temperature Cycling, Random Vibration, and Combined Loading for Airborne Applications.Crystals.2023,13(3):473
- The Study of the Reliability of Complex Components during the Electromigration Process.Micromachines.2023,14(3):499
- Effect of Surface Roughness on the Electrical Performances of CPW Transmission Lines Used in Future Ultra-High Frequency Applications.Micromachines.2023,14(1):104
- A thermally activated VO2-based attenuator with SRR structure.Materials & Design.2022,223:111260
- Effect of the reflow process on IMC growth for different devices and complex components.Smart Materials and Structures.2022,31(11):115028
- Hydrogen Storage Performance of γ-Graphdiyne Doped Li Based on First Principles for Micro/Nano.Micromachines.2022,13(4):547
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