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个人信息：Personal Information
教授 博士生导师 研究生导师
性别：女
毕业院校：西安电子科技大学
学历：博士研究生毕业
学位：工学博士学位
在职信息：在岗
所在单位：集成电路学部
入职时间：2015-11-20
学科：集成电路系统设计 微电子学与固体电子学
办公地点：西安电子科技大学北校区东大楼416室
联系方式：029-88202550
电子邮箱：
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射频集成电路与系统设计
- Temperature properties of the parasitic resistance of through-silicon vias (TSVs) in high-frequency 3-D ICs.IEICE Electronics Express
- Impedance matching for the reduction of signal reflection in high speed multilevel three-dimensional integrated chips.Journal of Semiconductors
- Reduction of signal reflection in high-frequency three-dimensional (3D) integration circuits.IEICE Electronics Express
- Electical models of through silicon vias and silicon-based devices for millimeter-wave application.International Journal of RF And Microwave Computer-aided Engineering
- Electrical modeling and analysis of differential dielectric-cavity through-silicon vias array.IEEE Microwave and Wireless Components Letters
- Wideband substrate integrated waveguide bandpass filter based on 3-D ICs.IEEE Trans. on Components, Packaging and Manufacturing Technology
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