孟凡博，西安电子科技大学副教授、硕导、高性能电子装备机电集成制造全国重点实验室骨干成员，博士为西安电子科技大学与新加坡国立大学联合培养，获得西安电子科技大学优秀博士学位论文、国家奖学金、华为奖学金、中国创翼大赛国家三等奖（人社部）等多项荣誉。以一作身份在机械工程学报、Advanced Function Materials、Additive Manufacturing等顶级期刊发表十余篇论文、授权专利20余项、起草企业技术规范1项。

长期致力于曲面、多材、多层微滴喷射一体化成型设备研究，主持国自然青基、陕西省青基、国防重点实验室基金等项目，以骨干身份参与国自然重点基金、JKW创新XX、JKW16X、JKW1XX、装发预研等重点项目。

每年招收1-2名硕士研究生，优先招收竞赛生（智能车、robomasters、robocon、电赛等均可），方向为机械设计、嵌入式软硬、算法等。

十篇代表作：

[1] 孟凡博, 黄进，白楠，张霄来.非可展开曲面多材喷射协同调控方法 [J]. 机械工程学报. 2023:559.

[2] Fanbo Meng, Jv Peng, Jin Huang, Pu Ping, Wenfeng Lu, Jinzhu Zhou, Peng Li. Computational Analysis Model of Intense Pulsed Sintering of Silver Nanoparticles [J]. Additive Manufacturing. 2022:51.102594. (中科院1区)

[3] Fanbo Meng, Mingchang Zhang, Jin Huang, Wenfeng Lu, JunminXue, Hao Wang. Additive manufacturing of stable energy storage devices using a multi-nozzle printing system[J]. Advanced Functional Materials. 2020:2008280. (中科院 1 区)

[4] Fanbo Meng, Jin Huang, Bu Ping.Intelligent control system for 3D inkjet printing[J]. Journal of Intelligent Manufacturing. 2022. (中科院1区)

[5] Yujin Ren, Fanbo Meng(共一), Siwen Zhang, Bu Ping, Hui Li, Bosi Yin, Tianyi Ma, CNT@MnO2 composite ink toward a flexible 3D printed micro‐zinc‐ion battery[J], Carbon Energy, 2022,1-12. (中科院1区)

[6] Fanbo Meng, Jin Huang, Pengbing Zhao. Closed-loop optimized nanometal sintering method[J]. Journal of Manufacturing Processes. 2020,59:403–410. (中科院2区)

[7] Fanbo Meng, Jin Huang, Tong Cao, Pengbing Zhao, Peng Li. Multi-sensor feedback control for the flash sintering of printed nano-silver ink[J]. Journal of Manufacturing Processes. 2020,53:356–363. (中科院 2 区)

[8] Fanbo Meng, Jin Huang, Pengbing Zhao. 3D-Printed Conformal Array Patch Antenna using a Five-axis Motion Printing System and Flash Light Sintering[J]. 3D Printing and Additive Manufacturing. 2018, 6(2). (中科院2 区)

[9] Fanbo Meng, Jin Huang. Evolution Mechanism of Photonically Sintered Nano-Silver Conductive Patterns[J]. Nanomaterials 2019,9 (258). (中科院 2 区)

[10] Bu Ping, Jin Huang, Fanbo Meng*, Prediction model and compensation method for curing shrinkage of inkjet 3D printing parts [J], Journal of Manufacturing Processes 2023,101:807–819. (中科院 2 区 )